Production Capacity
Technical Route - HLC
| Item | HLC technology route | |||
| 2019 | 2020 | 2021 | ||
| Maximum plate width (inch) | 25 | 25 | 25 | |
| Maximum plate length (inch) | 29 | 29 | 29 | |
| Maximum number of floors (L) | 16 | 18 | 36 | |
| Maximum plate thickness (mm) | 3.2 | 4.0 | 6.0 | |
| Maximum plate thickness tolerance | +/-10% | +/-10% | +/-10% | |
| Base copper thickness | Inner layer (OZ) | 4 | 6 | 8 |
| Outer layer (OZ) | 2 | 3 | 4 | |
| Minimum mechanical hole diameter (mm) | 0.20 | 0.15 | 0.15 | |
| PTH dimension tolerance (mil) | +/-2 | +/-2 | +/-2 | |
| Back drilling residual thickness (mil) | ~ 3 | ~ 2.4 | ~ 2 | |
| PTH maximum aspect ratio | 12:1 | 16:1 | 20:1 | |
| Item | HLC technology route | |||
| 2019 | 2020 | 2021 | ||
| Minimum PTH hole plate | Inner layer (mil) | DHS + 10 | DHS + 10 | DHS + 8 |
| Outer layer (mil) | DHS + 8 | DHS + 8 | DHS + 6 | |
| Anti-welding alignment accuracy (um) | +/- 40 | +/- 30 | +/- 25 | |
| Impedance control | ≥ 50ohms | +/-10% | +/-10% | -/-8% |
| < 50ohms | 5 Ω | 5 Ω | 4 Ω | |
| Minimum line width/line spacing (inner layer) | 3.0 / 3.0 | 2.6 / 2.6 | 2.5 / 2.5 | |
| Minimum line width/line spacing (outer layer) | 3.5 / 3.5 | 3.0 / 3.5 | 3.0 / 3.0 | |
| Maximum plug hole depression (um) | 30 | 20 | 15 | |
| Surface treatment type | ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au | |||
| Item | HDI technology route | |||
| 2019 | 2020 | 2021 | ||
| Structure | 5+n+5 | 6+n+6 | 7+n+7 | |
| Stacked hole structure | Any Layer (12L) | Any Layer(14L) | Any Layer(16L) | |
| Plate thickness (mm) | Min. 8L | 0.45 | 0.40 | 0.35 |
| Min. 10L | 0.55 | 0.45 | 0.40 | |
| Min. 12L | 0.65 | 0.60 | 0.55 | |
| MAX. | 2.40 | |||
| Minimum core plate thickness (um) | 50 | 40 | 40 | |
| Minimum PP thickness (um) | 30（#1027 PP） | 25（#1017 PP） | 20（#1010 PP） | |
| Base thickness | Inner layer (OZ) | 1/3 ~ 2 | 1/3 ~ 2 | 1/3 ~ 2 |
| Outer layer (OZ) | 1/3 ~ 1 | 1/3 ~ 1 | 1/3 ~ 1 | |
| Item | HDI technology route | |||
| 2019 | 2020 | 2021 | ||
| Structure | 5+n+5 | 6+n+6 | 7+n+7 | |
| Stacked hole structure | Any Layer (12L) | Any Layer(14L) | Any Layer(16L) | |
| Plate thickness (mm) | Min. 8L | 0.45 | 0.40 | 0.35 |
| Min. 10L | 0.55 | 0.45 | 0.40 | |
| Min. 12L | 0.65 | 0.60 | 0.55 | |
| MAX. | 2.40 | |||
| Minimum core plate thickness (um) | 50 | 40 | 40 | |
| Minimum PP thickness (um) | 30（#1027 PP） | 25（#1017 PP） | 20（#1010 PP） | |
| Base thickness | Inner layer (OZ) | 1/3 ~ 2 | 1/3 ~ 2 | 1/3 ~ 2 |
| Outer layer (OZ) | 1/3 ~ 1 | 1/3 ~ 1 | 1/3 ~ 1 | |
| Item | HDI technology route | |||
| 2019 | 2020 | 2021 | ||
| Anti-welding alignment accuracy (um) | +/- 30 | +/- 25 | +/- 20 | |
| Minimum resistance welding width (mm) | 0.070 | 0.060 | 0.050 | |
| Impedance control | >= 50ohm | +/-10% | +/-8% | +/- 5% |
| < 50ohm | +/- 5ohm | +/- 3ohm | +/- 3ohm | |
| Plate bending and warping control | ≤ 0.5% | ≤ 0.5% | ≤ 0.5% | |
| Cavity depth control (um) | Depth control drilling | +/- 75 | +/- 75 | +/- 50 |
| Laser ablation method | +/- 50 | +/- 50 | +/- 50 | |
| Surface treatment type | OSP、ENIG、Immersion Tin、Hard Au、 Immersion Ag | OSP、ENIG、Immersion Tin、Hard Au、Immersion Ag、 ENEPIG | ||
Technical Route - Soft Board And Soft Board Hard-bonded Board
| Item | Technical route of soft board and soft and hard combination board | ||
| 2019 | 2020 | ||
| Maximum number of layers of soft board | 6 | 8 | |
| Roll width/plate size (mm) | Roll width (inner layer) | 250 | 500 |
| Working plate size | 250 x 250 ~ 500 | 500 x 610 | |
| Minimum line width/line spacing (um) (L/S/Cu thickness) | Inner layer (base material copper) | 40 /40 / 12 50 /50 /18 |
35 /35 /12 45 /45 /18 |
| Outer layer (electroplated copper) | 55 /55 / 25 63 /63 /35 |
50 /50 /25 55 /55 /35 |
|
| Radium perforation structure | Minimum radium perforation (um) | 75 | 65 |
| Perforated structure | Y | Y | |
| Laser through hole (um) | 100 | 75 | |
| Machine hole size (um) | 150 | 100 | |
| Minimum hole plate design (um) | Inner layer (base material copper) | D + 225 | D + 175 |
| Outer layer (electroplated copper) | D + 200 | D + 150 | |
| Button electroplating | D + 250 | D + 200 | |
| Item | |||
| 2019 | 2020 | ||
| Covering film (CVL) (um) | Precision | +/- 150 | +/- 125 |
| Resistance welding (um) | Precision | +/- 50 | +/- 37.5 |
| Bridge width capacity | 100 | 75 | |
| Electrical measurement pad pitch (um) | Conventional fixture | 200 | 150 |
| Flying needle | 100 | 100 | |
| Soft-hard combination board technology | Number of soft board layers | Up to 4 w air gap | Up to 4 w air gap |
| Number of layers of soft and hard combination board | Up to 12 | Up to 16 | |
| Maximum size of soft and hard combination plate (mm) | ~ 250 x 400 | ~ 500 x 610 | |
| Minimum soft plate thickness (um) | 25 | 12 | |
| The thinnest rigid PP glass fiber type | # 1037 & # 1027 | # 1017 | |
| Surface treatment type | ENIG, ENEPIG, Hard Au, OSP | ||
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