Technical Support
| Item | HDI technology route | |||
| 2019 | 2020 | 2021 | ||
| Minimum mechanical drill hole diameter (um) | 200 | 200 | 150 | |
| Maximum through-hole aspect ratio | 8 : 1 | 10 : 1 | 10 : 1 | |
| Minimum radium perforation/perforation disc (um) | 75/ 200 | 70/ 170 | 60/ 150 | |
| Maximum radium perforation aspect ratio | 0.8 : 1 | 0.8 : 1 | 0.8 : 1 | |
| Structural design of laser perforating (VOP) on PTH | Yes | Yes | Yes | |
| Laser through-hole structure (DT≤ 200um) | NA | 60~100um | 60~100um | |
| Minimum line width/line spacing (L/S/Cu, um) | Inner layer | 45 /45 /15 | 40/ 40/ 15 | 30/ 30 /15 |
| Outer layer | 50 /50/ 20 | 40 /50 /20 | 40 /40 /17 | |
| Minimum BGA pitch (mm) | 0.35 | 0.30 | 0.30 | |
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