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Gold Finger Plate – Hole Plate In Multi-layer Gold Finger Plate
Base plate: FR4 Number of floors: 8 Plate thickness: 1.6mm Surface treatment: gold deposit Process features: BGA plug hole, wire density line, minimum hole 0.2mm
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Gold Finger Plate – Hole Plate In Multi-layer Gold Finger Plate
Detailed parameters
Base plate: FR4
Number of floors: 8
Plate thickness: 1.6mm
Surface treatment: gold deposit
Process features: BGA plug hole, wire density line, minimum hole 0.2mm
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